The Advanced Circuit Materials Division has announced RO4360G2™, next generation PCB laminates with improved thermal reliability for higher UL maximum operating temperatures (MOT’s).

In 2010, Rogers Corporation introduced its groundbreaking product, RO4360™ laminate, the first high Dk RF thermoset laminate. We have now launched the next generation, RO4360G2 laminate, with improved thermal reliability that will help fabricators achieve higher UL MOT’s.

With a tailored high Dk of 6.15 @ 10 GHz, this material allows next generation power amplifier designers to meet size and cost reduction targets. Specifically, the laminate’s higher Dk allows for a significant reduction in finished circuit board size (20-30%). RO4360G2 laminates process similar to FR-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B™ material.

RO4360G2 laminates are UL 94V-0 flame rated (pending) and fully lead-free process capable. They possess excellent thermal conductivity of .81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B laminates.

Typical applications for RO4360G2 laminates are power amplifiers, LNAs, RF components (combiners/splitters), patch antennas, and as a replacement material for designs previously employing LTCC (low temperature, co-fired ceramic). RO4360G2 laminates are the material solution designers working on 4G and next generation defense/aerospace platforms have been looking for!

One Response to High Frequency PCB Laminate Material Provides Improved Thermal Reliability for Higher Maximum Operating Temperatures

  1. […] that current is transformed to heat within a PCB might be best described by the PCB material’s thermal conductivity (TC). The TC, which is typically measured in watts of power per meter of material per degree Kelvin […]

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