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As the world continues to seek out new sustainable energy sources, as well as more efficient management of traditional sources, power management needs continue to evolve. Today’s wind and solar power alternatives generate large amounts of power and require more flexible and faster controllers. Compact, powerful and reliable methods of managing power are the key, and that’s where power electronics are critical.

wind_turbine_lgWith the help of materials and components developed by Rogers Corporation, Power electronics are enabling engineers to use electrical power efficiently and to lower environmental impact sustainably. Power electronics refers to an electrical system that conditions the power of a supply to suit the needs of the load by using fast and controllable solid-state switches known as power semiconductors. Today, devices like Insulated Gate Bipolar Transistors (IGBTs), conduct, block and control electrical energy for a wide array of energy generation, distribution and conversion applications and their use is expected to grow.The IGBT is used primarily as an electronic switch, combining high efficiency and fast switching for a wide array of medium- to high-power applications such as variable frequency power supplies, traction motor control and induction heating. As market demand and power requirements increase, ruggedness and reliability of these devices become even more critical.

At Rogers, we work closely with designers to develop solutions to address their most complex power electronic challenges. At the heart of these semiconductors, we provide substrates that act as interconnections to form an electric circuit (similar to a printed circuit board) and cool the components. Compared to materials used in lower power microelectronics, our substrates must carry higher currents and provide higher voltage isolation (up to several thousand volts) while operating over a wide temperature range (up to 150 or 200C).

Our patented curamik Direct Bond Copper (DBC) Substrates have long been the industry standard for power semiconductor substrates due to their thermal conductivity, excellent electrical insulation and good heat spreading characteristics so critical in power modules. A key advantage of our DBC substrates is their low coefficient of thermal expansion which ensures good thermal cycling performances (up to 50,000 cycles).

We also enable electrical distribution of the electrical current in power electronic modules with our RO-LINX laminated busbars used as key components of IGBTs. Our customized, three-dimensional constructions are utilized in power modules of traction propulsion systems for rail applications, wind and solar inverters, industrial frequency inverters, large UPS systems or power supplies and other applications requiring the distribution of electrical power.

For over 50 years, we have collaborated with designers to develop solutions to enable new devices that can reliably withstand increasingly heavier loads and higher temperatures. Our newest solutions enable designers in worldwide to integrate multiple functions to eliminate manufacturing steps, lower total systems cost, and enable more streamlined packaging. Our RO-LINX PowerCircuit solutions demonstrate our unique ability to understand customers design challenges and provide innovative solutions.

We know that reliability is critical when you’re dealing with power and designers know they can count on Rogers to perform rigorous testing of all of our products to ensure the highest standards in design and manufacturing. As the technology leaders in our industry, our global team of experts partners closely with design engineers to ensure reliability and to understand and develop robust solutions for next generation modules.

Learn more about our solutions for power electronics.


This post authored by John Coonrod originally appeared on the ROG Blog hosted by Microwave Journal.

Microstrip transmission lines are widely used throughout the high-frequency industry, for both active and passive circuits. They are building blocks for many components, including couplers, filters, resonators, and power dividers/combiners, along with various coupled features formed from microstrip lines that help transfer energy from one point in the circuit to another. Of course, the printed circuit board (PCB) material also plays a major role in how these microstrip transmission lines perform their duties in these RF and microwave circuits, and it can be helpful to understand how certain PCB material characteristics contribute to the ways that microstrip transmission lines and their coupled features perform in these different high-frequency components.

PrintCircuit board materials are selected by designers for a number of reasons, but usually with dielectric constant (Dk) at the top of the list. Maintaining consistent impedance for microstrip lines depends on consistent Dk for a PCB material since a change in PCB Dk at any point in the material will result in a change of impedance for the microstrip transmission lines at that point in the material. Using microstrip coupled features can complicate the choice of circuit materials since such coupled features typically exhibit different, even- and odd-order, wave modes as a function of the PCB material and circuit design. For electric fields between microstrip coupled features, the even-order modes use mainly the thickness or z-axis of the material, while the odd-order modes of the electric fields are mostly in the planar or length-width dimensions (x and y axes) of the PCB material as well as using some z-axis properties.

Ideally, PCB materials would exhibit tightly consistent Dk values in their x, y, and z dimensions, and modern computer-aided-engineering (CAE) software tools typically assume that they do. But in the real world, circuit materials more typically have differences between the Dk value through the thickness (z axis) of the material and the Dk value across the length and width (x and y axes) of the material. PCB materials are referred to as anisotropic in nature when they have different Dk values in the different axes of the material. In contrast, a PCB material with consistent Dk values in all axes is considered isotropic in nature.

Why the differences in Dk values through the material, and what effects can they have on different circuit designs? Most commercial PCB materials are at least slightly anisotropic in nature, due to the composition of those materials. They are formed with dielectric resin materials and some filler material, such as a glass or a ceramic filler, used for reinforcement and attribute adjustments, but which contribute to Dk variations. The manner in which fillers can orient within a substrate during the laminate manufacturing process accounts for the isotropic or anisotropic behavior for some laminates. Other laminates may have glass weave for reinforcement, which can cause Dk variations; the type of glass weave can impact the anisotropic behavior of the laminate. Combining the effects of these potential filler orientation variations with the effects of the glass weave can cause some laminates to exhibit higher variations in Dk in the different axes of the material, making them more anisotropic.

Designers working on microstrip circuits with coupled features often lean towards the use of PCB materials with higher Dk values, since those materials provide more efficient coupling of electric fields than their lower-Dk counterparts. In addition, since circuit dimensions required for a given impedance shrink on PCB materials with higher Dk values, smaller components can be developed with these higher-Dk materials. Unfortunately, the higher-Dk circuit materials also tend to be more anisotropic in nature than lower-Dk circuit materials, adding to the challenge of designing filters, directional couplers, resonators, and other high-frequency circuits based on microstrip transmission lines with coupled features.

PCB materials with high Dk values, typically 10 or more as measured in the z-axis of the circuit material at 10 GHz, can suffer from serious anisotropic characteristics that can challenge even the best of CAE simulation and design software programs. Circuit materials with a high degree of anisotropy may have, for example, a Dk of 10 through the thickness (z-axis) of the material as measured at room temperature and 10 GHz, but the Dk in the x-y plane of the same material may be different by 10% or 15%. When designing a microstrip circuit with coupled features, such as a filter, and using a CAE program, these variations in Dk values can be accounted for as a form of statistical approximation, but specific differences in Dk values, as might occur at a critical microstrip coupled feature, may not be precisely predicted in the CAE program. The variations in Dk typically result in performance variations in the final circuit, which yield differences between performance parameters predicted by a CAE program and performance parameters measured for a prototype with test-and-measurement equipment.

For designers of microstrip circuits with coupled features, variations in PCB material Dk can be detrimental to achieving expected performance results, fortunately commercial PCB materials with high Dk values are available with relatively isotropic natures. For example, the TMM® 10i circuit materials from Rogers Corp. are quite isotropic compared to other circuit materials with Dk value around 10.0. These are ceramic hydrocarbon thermoset polymer composite materials well suited for both microstrip and stripline high-frequency circuits. The TMM 10i circuit materials exhibit a Dk of 9.80 which remains within +/- 0.245 of 9.80 in all three axes of the material. (The Dk measurements are performed at 10 GHz in the z-axis of the material according to IPC-TM-650, method For designers in need of a PCB material with even higher Dk value, the TMM 13i circuit material offers a Dk of 12.85 +/- 0.35 as measured at 10 GHz in the z axis using the same test method.

These circuit materials are more isotropic than most, with differences of typically 3% or less between the Dk value in the z-axis of the material and the x-y plane of the material. Compare this to the circuit materials noted earlier with differences of 10% or more. In addition to their isotropic natures, the TMM 10i and TMM 13i materials feature coefficients of thermal expansion closely matched to that of copper, supporting production of such circuit features as plated through holes (PTHs) with high reliability.

Of course, CAE design and simulation software continues to advance, and get better at anticipating such variations as found in anisotropic PCB materials. But for some designs, such as those with microstrip transmission lines and coupled features, even small variations in Dk can be disruptive. For designers working with microstrip coupled features and hoping to avoid surprises, the right choice of PCB material can help.

Do you have a design or fabrication question? John Coonrod and Joe Davis are available to help. Log in to the Rogers Technology Support Hub and “Ask an Engineer” today.


Dr. Xinhe Tang delivered two new papers on hybrid substrates at PCIM Asia 2014 and PCIM Europe 2014. Download your copy today from the Power Electronic Solutions Design Support Hub.

PCIM Asia 2014: Baseplate Cooling of Power Modules with Hybrid Substrate

The demand for fluid cooling of high power semiconductors increases continuously. Baseplate cooling with PinFin or “ShowerPower®” (patented technology by Danfoss) has attracted more attention. Previously, a hybrid substrate of directly bonded copper and adhesively bonded aluminum was introduced and the manufacturing technology developed. The hybrid substrate has been further developed and characterized in the present work.


The material combination and back side structure of Al-baseplate have been optimized to reduce thermal and mechanical strain. A power module has been built using the hybrid substrate and direct baseplate cooling of the power module has been carried out.

This paper reports on the results relating to thermal shock cycling, heat treatment, and flatness at various temperatures, as well as performance testing and reliability against chemical media involved in the manufacturing process. Finally, power module cooling using the hybrid substrate is discussed.

Download: Baseplate Cooling of Power Modules with Hybrid Substrate

PCIM Europe 2014: Hybrid Substrate: A Future Material for Power Semiconductor Modules

The increasing level of integration in semiconductor power modules has led to higher power densities that, in turn, result in an increased need for better thermal management. Lately, liquid cooling is attracting more attention as a method to ensure the higher performance and reliability of these modules.

This paper introduces a hybrid substrate of copper, ceramic, and aluminum that combines the thermal and electrical performance of the copper with the corrosion resistance of aluminum using a ceramic dielectric. In this manner, the aluminum can directly contact the cooling water, improving cooling efficiency without the worry of corrosion. The copper portion can be used for the circuit, leveraging its superior current carrying and heat spreading capabilities.

Screen shot 2014-08-19 at 2.11.32 PM

This paper reports on the work of developing such a hybrid substrate by bonding aluminum to the back side of DBC using an adhesive, and explores its application in power electronics.

Download: Hybrid Substrate: A Future Material for Power Semiconductor Modules

Evaluating the cost of a product throughout its lifetime isn’t new to the rail industry. Whether you call it Cost of Ownership, Product Life Cycle Cost Analysis, Life Cost Analysis (LCA), Whole Life Cost, or “Cradle to Grave” Costing, establishing a cost of ownership is important.

Many municipalities and governments require a cost of ownership as part of a tender offering and several transit authorities have expanded the criteria to include end-of-life costing and the triple bottom line of the cost impact upon environmental sustainability.

If you’re looking for a quick way to calculate the cost of ownership of rail seat cushions, this free Seat Cushion Cost of Ownership Tool allows you to simulate a specific scenario by entering the size of the seat cushion, number of seats per car, and number of cars in the fleet as shown below.


For more advanced options, click show advanced options and the below specification will appear. The use will be allowed to enter in the average number of years between refurbishments, cost of competitive materials, labor rates, estimated number of replacements, need for fire barriers, and revenue loss. The calculator presents a picture of the total cost of ownership for each material along with metric tons of material that will be designated for landfill over the time period.


Rogers Corporation, the manufacturer of BISCO MF1 open cell silicone foam specially formulated for rail car seating cushions launched the Seat Cushion Cost of Ownership Tool. It will be up to the user to add in the hidden costs (if applicable).

Screen shot 2014-08-08 at 1.33.54 PMNow you can access Rogers’ PCB materials resources with the ROG Mobile App. Quick and easy access to calculators, literature, technical papers. You can even request samples on your smartphone or tablet

  • The app has tools and technical information to assist you with Rogers printed circuit board materials.
  • The Microwave Impedance Calculator assists with microwave circuit design in predicting the impedance of a circuit made with Rogers High Frequency circuit materials and also provides capabilities for predicting transmission line losses.
  • The ROG Calculators assist RF engineers with thermal and mechanical simulations for microwave PCB designs.
  • Data sheets and fabrication guides can be downloaded and material samples can be ordered.

ROG Mobile for iPhone and iPad devices:

Apple App Store

Available for the iPhone and iPad in the Apple App Store

ROG Mobile for Android devices:

Android Play Store

Available for Andoid devices in Google Play


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