Rogers Power Electronics Solutions group provides advanced materials technologies that significantly increase efficiency, manage heat, and ensure the quality and reliability of your electronic devices.

See the latest PES developments at PCIM Europe 2016, the leading technical conference and exhibition devoted to power electronics, intelligent motion, renewable energy, and energy management. Stop by and see us in Hall 9, Booth 406, May 10-12, 2016.

Take a look inside our newest power management systems in the following videos:

New Capacitor-Busbar Power Management Technology

ROLINX® CapEasy and ROLINX® CapPerformance are capacitor-busbar assemblies that combine a unique Power Ring Film Capacitor™ technology from SBE Inc. and the well-known ROLINX Laminated Busbars from Rogers Corporation. The new assembly provides extreme low inductance and high power density. This enables smaller, lighter electronic designs with higher current handling capabilities for a wide range of applications, from automotive electronics to solar-power and wind-power systems.

New Method for Welding Capacitors to Busbars

Dirk Maeyens, Global Director of Sales, Power Electronics Solutions, discusses a new method for connecting capacitors to busbars for use in high-power inverters. Spot welding is used to make a sturdy connection that also reduces the amount of inductance in the connection. The new connection method is particularly appropriate for puck capacitors and is expected to find use in vehicles and solar power conversion.

Rogers zeigt seine neueste Bus-Bar-Power-Lösung

In dieser Episode von PSDtv, erklärt Rogers die Kombination fortschrittlicher Kondensator-Technologie von SBE mit seinen ROLINX Stromschienen auf der APEC 2016. ROLINX nutzt die SBE Power Ring-Film-Kondensator-Technologie, für Kondensator-Busbar-Baugruppen mit extrem geringer Induktivität und hoher Leistungsdichte.

Rogers Corporation (NYSE: ROG) plans to announce results for Q1 2016 after the close of trading on Monday, May 2, 2016. A copy of the release will be available at www.rogerscorp.com/news.

Rogers Corporation logoAll interested parties are invited to participate in Rogers’ quarterly teleconference to be held on Tuesday, May 3, 2016 at 9:00 am ET. Bruce D. Hoechner, President and CEO, and members of senior management will review the results and then respond to questions.

To participate in the teleconference, please call 1-800-574-8929 toll free in the U.S. or 1-973-935-8524 from outside of the U.S. There is no passcode for the teleconference.

For interested parties who do not wish to ask questions, the call is being webcast live by Thomson Reuters and may be accessed at www.rogerscorp.com/ir.

A slide presentation will be made available prior to the start of the call. The slide presentation may be accessed at www.rogerscorp.com/ir.

If you are unable to participate during the live teleconference, the call will be archived until Monday, May 9, 2016. The audio archive can be accessed by calling 1-855-859-2056 in the U.S. or 1-404-537-3406 from outside the U.S. The passcode for the audio replay is 87264976. To access the archived audio online, please visit the Rogers Corporation website and click on the webcast link.

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This post authored by John Coonrod, Technical Marketing Manager, and team originally appeared on the ROG Blog hosted by Microwave Journal.

Thin can be a good thing for high-frequency circuit laminate materials. As this blog detailed some years ago, thinner printed-circuit-board (PCB) laminates offer many electrical benefits as well as mechanical advantages compared to thicker circuit materials, especially at higher frequencies reaching into millimeter-wave bands. For applications where weight and size are critical, such as circuits for portable and mobile products, thinner circuit laminates are important starting points that can lead to miniature, lightweight solutions. In terms of electrical performance, thinner laminates offer many benefits over thicker circuit materials, in particular for microstrip circuits operating at millimeter-wave frequencies.

PCB laminatesMicrostrip is one of the most widely used transmission-line technologies for RF/microwave circuits. As the ROG Blog has noted many times, microstrip circuits are highly dependent upon the choice of circuit laminate for optimum performance. The best microwave performance results from the right mix of circuit material parameters, such as consistent dielectric constant (Dk) and high-quality copper conductor layers, right down to the thickness of the laminate. Ideally, microstrip circuits fabricated on the right laminate composition and thickness will achieve excellent electrical performance with low loss and minimal unwanted resonances or spurious signals.

However, thicker circuit laminates can pose problems for microstrip circuits, with the thickness measured as substrate only and without the thickness of the copper included. When microstrip circuits are fabricated on thicker laminates, unwanted resonances can occur. These resonances arise between a laminate’s metal layers and can disrupt the desired signal propagation of the quasi-transverse-electromagnetic (quasi-TEM) waves through the microstrip transmission lines.

Excessive conductor width can also be a concern when attempting to minimize spurious generation in microstrip circuits. If microstrip signal conductors are wider than one-eighth wavelength at the design frequency, resonances can occur between the edges of the conductors. These spurious-mode resonances can interfere with the desired signal propagation through the microstrip conductors. Since wavelengths shrink with increasing frequencies, attention must be paid to circuit structures and circuit material dimensions to avoid such opportunities for spurious generation. At millimeter-wave frequencies (above about 30 GHz), in particular, where the wavelengths become extremely diminutive, careful balance is critical between circuit laminate thickness and circuit dimensions for optimum circuit performance.

Those smaller wavelengths call for thinner laminates to minimize any opportunities for spurious signal generation. At the same time, narrow circuit conductors can help prevent any generation of edge-to-edge conductor resonances. At higher frequencies, microstrip conductors are typically designed and fabricated for a controlled impedance, such as 50 Ω, to achieve signal transference with low losses and minimal reflections. The consistently narrow conductor widths required to achieve a controlled impedance across a PCB also provide the circuit physical conditions needed to minimize edge-to-edge conductor resonances.

As noted in the earlier ROG Blog, the Dk of the circuit laminate also plays a role in determining the circuit dimensions required for a particular design impedance, including the conductor widths. For a given laminate thickness, design frequency, and microstrip impedance, the circuit dimensions will shrink with increasing value of Dk. As a result, circuit miniaturization can be achieved by designing and fabricating microstrip and other transmission-line technologies on circuit laminates with higher Dk values.

Thinner circuits offer benefits in terms of controlling electromagnetic interference (EMI). As microstrip circuits increase in frequency, they also tend to radiate more EM energy. When the level of radiated EM energy becomes excessive, it can interfere with the proper operation of the circuit from which it originates as well as any circuits nearby. When compared at the same high operating frequency, thinner microstrip circuits will radiate less EM energy than thicker circuits, so that thinner circuits have the potential for less EMI problems. Less radiation loss also equates to less signal loss for a microwave circuit.

Microstrip is a practical and straightforward transmission-line approach for many high-frequency circuit designs, but it may not always be the best choice for all designs, especially those sensitive to the effects of spurious signals and radiation. Grounded coplanar waveguide (GCPW) is an alternative transmission-line technique that has proven effective for minimizing spurious modes and EM radiation. It can be used with thicker circuit laminates, although better results can be achieved with thinner circuit materials. When comparing microstrip and GCPW for the same circuit material and material thickness, GCPW circuitry has much less spurious generation and suffers much less EM radiation than microstrip circuitry for the same operating frequency.

The choice of transmission-line technology and circuit laminate thickness at higher frequencies can also be influenced by whether or not dispersion is a concern.  Dispersion is a characteristic of transmission lines and circuit substrate materials in which different transmission lines may exhibit different group velocity or group delay with frequency, essentially with the smaller waves of higher frequencies slowing down as a result of the transmission lines. For narrowband circuits, dispersion is not a problem. But it can be problematic for broadband circuits, for longer circuits (with longer delays), and for pulsed waveforms, since the time for a high-speed pulse to travel through one type of transmission line will not be the same as for a transmission line with longer group delay. Transmission lines differ in their dispersion characteristics: microstrip and some types of waveguide suffer longer group delays compared to nondispersive transmission-line formats like stripline and GCPW.

For higher-frequency circuits, GCPW can minimize dispersion compared to microstrip, but it can also be more challenging to manufacture at higher frequencies, especially with the fine dimensions and circuit features required for millimeter-wave frequency operation. GCPW is more sensitive to the copper plating thickness variation due to the PCB fabrication process than microstrip, and can suffer circuit-to-circuit performance variations in insertion loss and phase response as a result of variations in laminate copper plating thickness. The inherent advantages of GCPW over microstrip in terms of dispersion characteristics can be nullified unless a circuit with tight tolerance in copper plating thickness is specified, along with tightly controlled Dk and overall laminate thickness. Thinner circuit materials can provide many benefits, provided that the tolerances of those circuit laminates are tightly controlled.

PCB laminatesROG Mobile App

Download the ROG Mobile app to access Rogers’ calculators, including the popular Microwave Impedance simulation tool, literature, technical papers, and the ability to order samples of the company’s high performance printed circuit board materials.

Ask an Engineer

Do you have a design or fabrication question? Rogers Corporation’s experts are available to help. Log in to the Rogers Technology Support Hub and “Ask an Engineer” today.

 

 

 

Our engineering teams regularly deliver breakthroughs in reliability, efficiency, and performance for advanced materials technologies. Here’s what’s new to help you build a cleaner, safer, and more connected world.

Advanced Connectivity Solutions

Rogers Advanced Connectivity Solutions manufactures high frequency PCB laminates and prepregs that are engineered to exact performance requirements.

New Laminates Enable 79 GHz Technology Advancements

79GHz_articleMillimeter wave (mmWave) applications are increasingly used in automotive electronic systems, such as automated steering and collision avoidance, and to provide the bandwidth needed for improved data throughput and video performance in 5G wireless communications systems. But first, new techniques must be developed to affordably fabricate circuits, devices and components for use above 30 GHz. Download the article.

VIDEO: Rogers Scales up Production and Integrates Arlon Products

I-Connect007 editor Pete Starkey interviews our European Sales Manager John Hendricks at Productronica. Hendricks updates Starkey on Rogers’ acquisition of Arlon, and explains how the Arlon products complement Rogers’ existing materials.

Power Electronics Solutions

Rogers Power Electronics Solutions Division provides advanced materials technologies that significantly increase efficiency, manage heat, and ensure the quality and reliability of your device.

New ROLINX® CapEasy and ROLINX® CapPerformance Improve Power Efficiency and Manage Heat

ROLINX_CapEasyThe newest additions to the ROLINX® busbar family incorporate a unique Power Ring Film Capacitor™ technology from SBE Inc. and the well-known ROLINX Laminated Busbars from Rogers Corporation. The new capacitor-busbar assembly provides extremely low inductance and high power density. The result is a small, lightweight system ideal for HEV/EV powertrain inverters, solar inverters, and wind inverter systems. http://www.rolinx.com

VIDEO: Increasing Efficiency, Performance, and Thermal Management of Power Electronics

The world is demanding more efficient power for the devices of tomorrow. Rogers’ Power Electronics Solutions are pioneering new markets around the world for power semiconductors, modules, and devices based on optimum thermal management and power distribution. This video highlights the ROLINX® Busbars, designed with optimized inductance and controlled partial discharge for longer lifetime and optimum electrical performance. Also featured are curamik® substrates with thick copper cladding for high heat conductivity, high heat capacity, and curamik® micro-channel coolers for liquid or passive cooling. Watch the video.

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Our engineering teams regularly deliver breakthroughs in reliability, efficiency, and performance for advanced materials technologies. Here’s what’s new to help you build a cleaner, safer, and more connected world.

Elastomeric Materials Solutions

Rogers Elastomeric Material Solutions are engineered for superior performance, from ultra-thin protection for sensitive electronics to flexibility and impact protection for athletic gear to robust gasketing for automotive applications. Our unique, open cell structure produces a breathable foam that’s soft to the touch and won’t break down with continual use.

Screen Shot 2015-12-31 at 11.31.27 AMThe Hidden Costs in Product Life Cycle Cost Analysis

Many buyers require a Product Life Cycle Cost Analysis. For foam materials, such an analysis covers cost of the initial new product, assumptions about how far into the future the product will be used, cost of refurbishment, etc. Download the paper here.

Condux Plus™ Foams for Mobile Devices

condux_plus_foamWith complicated handheld designs come unexpected electrical grounding and shielding challenges that require immediate solutions. Our Condux Plus™ foam serves as a trusted grounding pad within mobile devices with highly reliable electrical conductivity, excellent mechanical properties, and greater shielding capabilities. Get the product specs here. 

Consumer Products

Footwear_cushioning_testThe Rule of Thumb for Measuring Foam Cushioning Properties in Footwear

Footwear designers and consumers alike often try to feel whether a foam will be comfortable underfoot by squeezing it between their thumb and forefinger. Pinching foam can be a first evaluation for foam softness, but to understand the cushioning properties of the foam for underfoot uses, you need to dig further. Here’s why?

New XRD® 810 Hex Figure 8

16528400250_bae8e53e69_oWhen protecting sensitive joints, flexibility and range of motion are essential. The hex pattern of the X-Pad Figure 8 provides a thin, flexible pad that can be used in shoulder, elbow, and knee applications. Choose XRD® Impact Protection for high and low speed impact protection or PORON® Slow Rebound custom contouring foam for comfort, support, and even pressure distribution. Download the product specs here. 

 
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