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Rogers Corporation’s Printing Division will be exhibiting at this year’s FTA INFO*FLEX in Baltimore, Maryland April 28-29.  Attending this event is a great opportunity to network while learning from industry innovators and technical minds.

If you plan on attending INFO*FLEX, visit the R/bak® materials team at booth 910 to learn more about R/bak® cushion mounting materials for corrugated, flexible packaging, and tags and labels.

Need help locating the Rogers Corporation booth? Use the INFO*FLEX exhibitor list as your guide.

If you won’t be able to attend INFO*FLEX, visit Rogers Corporation’s website to learn more about our product lines, request samples, and watch technical training videos. Stay connected with Rogers R/bak materials on Twitter, Google+ and here on our blog for more news and events.

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Are you designing a printed circuit board (PCB) antenna? Are you considering the effects of passive intermodulation (PIM) in your design?

This Coonrod’s CORNER video will tell you which factors to take into account when designing your antenna – everything from connectors to copper surface roughness.

Check out Rogers’ PIM testing results by watching the video below!  Tweet us your thoughts at @Rogers_ACM.

Rogers Advanced Circuit Materials division is honored to be the recipient of Printed Circuit Design & Fab’s 2014 New Product Introduction (NPI) Award. The award was presented March 25th during a ceremony at the IPC Apex Expo in Las Vegas.

Dale Doyle, Rogers Applications Development Manager, accepts NPI award from Mike Buetow, Editor in Chief of PCD & Fab.

Dale Doyle, Rogers Applications Development Manager, accepts NPI award from Mike Buetow, Editor in Chief of PCD & Fab.

Rogers won the Specialty Substrate Materials category for COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) Film. COOLSPAN TECA is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings.

Watch the video below to learn more about the product from Product Manager, Mark Seelhammer.

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Experience the innovation of COOLSPAN TECA firsthand! Request your sample today and see why it’s this year’s winner.

 

A rapidly growing array of power electronics products are used to convert raw energy into controlled and regulated power, from insulated bipolar gate transistors (IGBT) to high voltage direct current (HVDC) systems to vehicle propulsion. Rogers Power Electronics Solutions Division has launched a new web site that features advanced materials technologies for increasing efficiency, managing heat, and ensuring the quality and reliability of your device.

 

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The site covers APPLICATIONS of high power electronics: High Power Electronic Packaging, High Performance Cooling, and High Power Conversion and Distribution. High power electronics are used in a wide range of demanding MARKETS include: Automotive, Mass Transit, Clean Energy, Industrial, High Reliability, Major Appliances, and Telecommunications.

A discussion of power distribution technologies covers: Direct Bond Copper Substrates, Active Metal Brazing Substrates, and Busbar Technology.

The site features curamik® Ceramic Substrates, curamik® Micro-Channel Coolers, RO-LINX® busbars and services:

 

 

In this Coonrod’s CORNER video, “How to Interpret High Frequency Circuit Material Data Sheets,” John Coonrod explains the main categories within high frequency laminate data sheets: Circuit Design, Circuit Fabrication and Reliability Issues.

He also deciphers key concepts such as Dissipation Factor, Dielectric Constant, Dielectric Loss, Thermal Coefficient of Dielectric Constant, Peel Strength and Thermal Conductivity. Watch now: http://bit.ly/1llyJUR

After you’ve completed the video, tell us your thoughts! Tweet us @Rogers_ACM #CoonrodsCORNER

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