The increasing demand for higher power densities, higher chip junction temperatures, and longer lifetime cycles for power electronics systems requires new substrate technologies and materials. State-of-the-art power electronics modules based on alumina and aluminum nitride ceramic will reach their limits soon, especially in such applications as HEV/EV or offshore wind turbines. New insulating materials and substrate technologies are needed now.

Ulrich Voeller, curamik Product Manager, presented at this year’s IMAPS  (International Microelectronics and Packaging Society) Conference in La Rochelle, France. His presentation, “Rogers_Si3N4_DCB_AMB_20130117,” compares and contrasts various substrate technologies and discusses the latest developments in silicon nitride substrates.

Power electronic substrates based on Silicon Nitride are helping designers find new ways to ensure reliability and high efficiency electronic systems. Research shows that the reliability of Si3N4 substrates can be 20-50 times better than conventional ceramic DBC materials, depending on the metallization method. Si3N4 DBC is improved 20 times compared to constructions using Al2O3 or AlN. Si3N4 AMB improves thermal cycling behavior 50 times.