Power electronics is changing rapidly. New packaging technologies are facing a rise in chip temperatures as seen in such applications as EVs / HEVs. Electronics increasingly need longer lifetimes to function in harsh conditions, such as wind turbines. Power electronics based on SiC components need to handle faster switching in the face of higher temperatures. While beneficial, the challenge is that these changes produce considerable stress on power systems and, consequently, result in reliability problems.

Traditional power module designs were primarily based on Al2O3 or AlN ceramics. But the need for higher performance is leading designers to choose more advanced substrates. substrates with Si3N4 ceramics use the excellent bending strength, high fracture toughness, and good thermal conductivity of Si3N4 to build substrates that can handle a variety of today’s challenges.

In the following video, the Power Electronics Solutions team at Rogers takes a look at how to make the right substrate choices to support demanding applications.

VIDEO: 3 Steps to Select the Right DBC / AMB Ceramic Substrate for Your Application

In this video, Olivier Mathieu, Product Innovation Manager, discusses how to use the latest substrates in power electronics designs. He walks us through: (a) How to select the right ceramic thickness and its influence on basic isolation voltage, (b) How to select the right ceramic grade and its influence on heat removal, and (c) How to select the right copper thickness and its influence on functional isolation, ampacity, and heat removal.

Watch the video, Selecting the Right DBC / AMB Ceramic Substrate.

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curamik® electronics, which is part of Rogers’ Power Electronics business, will be presenting at the eCarTech Conference in Munich on October 23-25,
2012.  This conference takes place during  the 4th International Fair for Electric- and Hybrid-Mobility for electric vehicles. curamik recently released a new silicon nitride (Si3N4) ceramic substrate that can significantly extend the life span of power electronic modules, and will be presenting this product at the conference.

Manfred Götz, Product Marketing Manager from curamik will be giving a presentation about this new ceramic substrate on Thursday, October 25th at 3:00 PM:

“How silicon substrate can increase the duration of power modules”

“In test cycles we have conducted so far, ranging from -55 °C to 150°C , curamik® silicon nitride substrates have shown more than a 10X improvement over substrates typically used in the Automotive segment, especially HEV/EV. From this data, we can expect to see a longer life span for modules using these substrates,” reports Manfred

 About curamik’s New Ceramic Substrate 

Until now, the reliability of copper-bonded ceramic substrates used in power modules has been limited by the lower flexural strength of the ceramic that can result in reduced thermal cycling resistance. For applications combining extreme thermal and mechanical stress, such as hybrid and electric vehicles (HEV/EV), the current commonly used ceramic substrates are not optimal. The significant difference in thermal expansion coefficients of the substrate (ceramics) and the conductor (copper) exert stress on the bonding zone during thermal cycling, threatening reliability. Rogers Corporation introduced a new silicon nitride ( Si3N4) ceramic substrate under its curamik® ceramic substrates brand. Due to the higher mechanical robustness of silicon nitride relative to other ceramics, the new curamik® substrate is intended to help designers achieve critical, long-life performance under the demanding operating environments and conditions of HEV/EV renewable energy applications and other high reliability applications.

With the growth of HEV/EV and renewable energy applications, designers have struggled to find new ways to ensure reliability of the electronics required to power these new, challenging technologies. With an increase in operating life span of potentially ten times or more relative to other ceramics used in power electronics, silicon nitride substrates provide the mechanical robustness critical to achieving the necessary reliability requirements. The life span of ceramic substrates is measured by the number of repetitions of thermal cycles the substrates can survive without delamination or other failure modes that compromise the function and safety of the circuit. This testing is typically done by cycling the samples from – 55° C to 125°C or 150°C.

Download the data sheet.

The entire event will cover these topics:

  • Electric Vehicles
  • Drive and Motor Technique
  • Energy Storage Technology
  • Engineering and subcontracting
  • Reparation and spare parts
  • Connected Car – sMove360°
  • MATERIALICA – Lightweight Design for New Mobility
  • Finance
  • eCarLiveDrive – Test Area

For More information:

curamik electronics GmbH
A division of Rogers
Am Stadtwald 2
92676 Eschenbach, Germany
phone: +49964592220
fax:+499645922222
e-mail: info@curamik.com
www.curamik.com