I am ROGERS. Meet Dora Pena.

On November 1, 2016, in Advanced Connectivity Solutions, by sharilee

Meet Dora Pena. For 12 years, she’s been part of our Advanced Connectivity Solutions group.

“I make laminates for antenna customers that enable billions of smartphone users to connect with each other.”


When anticipating today’s rapidly changing technologies, it is critical to have materials with the performance and reliability to meet ever-increasing reliability standards. Rogers’ Advanced Connectivity Solutions manufactures high frequency laminates and prepregs that are engineered for exact performance requirements.

About our Employees

Throughout our organization, our cultural behaviors describe how our employees work and are judged by our customers, business partners, investors, and each other.

Live Safely: I actively prevent injuries for everyone, everywhere, every day.

Trust: I respect people and trust them to do the right thing.

Speak Openly: I courageously seek and speak the truth.

Innovate: I create market-driven solutions that lead to customer success.

Just Decide: I make informed decisions rapidly to drive progress.

Simply Improve: I continuously simplify how I do things to achieve excellence.

Deliver Results: I align and achieve my goals to deliver our “Must-Do” results.

Together, we are changing our culture as we help change the world around us. For over 180 years, the employees of Rogers Corporation have focused on our customers, delivering world-class solutions to meet their most demanding materials challenges.


This post authored by John Coonrod, Technical Marketing Manager, and team originally appeared on the ROG Blog hosted by Microwave Journal.

Congratulations to our Advanced Connectivity Solutions team on their 100th ROG Blog post. For six years they have been providing technical advice about PCB design for RF/microwave applications. Here’s to 100 more posts!


Predicting the future is never easy. Similarly, knowing which types of circuit materials will be needed for the next decade’s RF/microwave applications can be difficult to predict, but the past can provide invaluable guidance. With this being the 100th installment in this series, the previous six years of ROG Blogs provide a bit of a map for the high-frequency road ahead and what might be needed in terms of electrical and mechanical characteristics for what are expected to be large-volume applications in this industry, including in radar-based automotive electronics systems, Fifth Generation (5G) wireless communications systems, and Internet of Things (IoT) sensors almost everywhere.

This first six years of the ROG Blog offered guidance on the use of many different types of circuit materials from Rogers Corp., for everything from high-frequency analog circuits to high-speed digital circuits. It explored the effects of circuit material characteristics on the performance of different types of high-frequency transmission lines, including microstrip, stripline, and various types of coplanar waveguide (CPW) transmission lines. And it has examined how the choice of printed-circuit-board (PCB) material impacts the performance of many different types of components, such as low-noise amplifiers, power amplifiers, delay lines, filters, and resonators.

In the next few years, this industry is expected to face new challenges in circuit design, with the high-volume growth of automotive electronics systems, 5G wireless, IoT, even with the steady growth of existing wireless applications such as WiFi and WLAN.

For many high-frequency circuit designers, wireless communications systems such as Third Generation (3G), Fourth Generation (4G), and Long Term Evolution (LTE) have represented rapid growth areas. But even without a standard in place, excitement is growing for the coming of 5G wireless communications systems and the type of services they will provide in the years to come, including fast wireless data with almost zero latency. Transferring high-speed digital signals will be an important part of any future communications network and the ROG Blog from January 22, 2015, “Selecting PCB Materials For High-Speed Digital Circuits,” detailed how RO4003™ circuit materials provided the proper mix of characteristics for speeds to 25 GB/s and beyond.

Higher-frequency (millimeter-wave) signals are expected to play important roles in 5G next-generation communications systems, and the ROG Blog has already provided several installments on choosing materials for millimeter-wave circuits, such as “Making The Most of Millimeter-Wave Circuits” and “Matching Materials To Millimeter-Wave Circuits.” Since millimeter-wave frequency bands are planned for high-data-rate backhaul links throughout 5G networks, the need for circuit materials capable of reliable, low-loss performance at 50 through 70 GHz should continue to grow, prompting more ROG Blogs on this topic.

The expected boost in the number of wireless signals in use during the next decade should also focus circuit designers’ attention on the material characteristics needed for low-PIM performance. An earlier ROG Blog, “Perusing PCBs For Low PIM Levels,” explained the role of circuit materials in the design of PCB antennas and how circuit material characteristics should be chosen to minimize PIM. That blog presented Rogers’ RO4725JXR™ and RO4730JXR™ circuit laminates as non-PTFE, halogen-free circuit materials with the characteristics needed to minimize PIM. With the growing number of wireless signals to be generated during the coming decade, in high-volume applications such as 5G and IoT, the importance of minimizing PIM only increases and certainly should be a recurring topic of this ROG Blog series.

The first six years of the ROG Blog series provided circuit specifiers with key insights on different aspects of circuit materials, such as material parameters important for impedance matching, for dissipating heat, and for minimizing losses. ROG Blogs have explored such things as the importance of circuit laminate finish, in “Finish Makes a Difference in Broadband PCB Loss,” and the reason for using a high-dielectric-constant (Dk) circuit material, in “Harness High-Dk Circuit Materials.” The next 100 ROG Blogs hope to provide guidance on the best use of these high-frequency materials, as starting points for what appears to be many high-frequency, high-speed circuits in the decade to come.

ROG Mobile App

Download the ROG Mobile app to access Rogers’ calculators, including the popular Microwave Impedance simulation tool, literature, technical papers, and the ability to order samples of the company’s high performance printed circuit board materials.

Ask an Engineer

Do you have a design or fabrication question? Rogers Corporation’s experts are available to help. Log in to the Rogers Technology Support Hub and “Ask an Engineer” today.

A huge thank you and best wishes to Fred Seidel, Customer Service Manager, on his retirement from Rogers. Known as Mr. PORON, Fred has a deep and extensive knowledge of all of Rogers’ elastomeric products, including the PORON® family of polyurethane materials. From its beginnings as a sintered vinyl used as an insole wrap in the shoe industry, to today’s wide range of formulations, PORON materials deliver durable, long-term performance in gasketing, sealing, and cushioning applications. Fred’s professional expertise will be greatly missed. Again, our best wishes go with you Fred – enjoy your retirement!


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Today’s manufacturers face rapid change, increasingly complex products, and pressure to increase efficiency while reducing costs and improving product quality. Lifecycle management and the traceability of manufactured goods have become an important part of the supply chain process. The goal is to embed automation in the product flow, tracking products in order to increase the efficiency and visibility of production, improve production planning and inventory management, and enhance the efficiency of enterprise resource planning.

Figure 1. Example QR code. Try reading it with your smartphone.

Figure 1. Example QR code. Try reading it with your smartphone.

At the core of this traceability is automatic identification (AutoID) and data capture. AutoID instantly recognizes and tracks objects, collects data about them, and enters that data directly into a computer. Management decisions can then be made more quickly and flexibly. AutoID technologies include one-dimensional and two-dimensional codes, RFID, biometrics, OCR, and smart cards.

Beyond tracking traditional warehoused goods, AutoID will be an important foundation for the Internet of Things (IoT) ecosystem. At the individual component level, IoT will rely on “smart objects” with unique IDs that can be seen within the Internet environment. According to Liukkonen and Tsai,

In manufacturing, IoT is about the integration of identifiable embedded computer-like systems in the infrastructure of the Internet and the business, which is based on software and services, built around it. The next technological advancement of IoT seems to concentrate on the development of a more complex network of interconnected objects (i.e., things) which can complete a variety of tasks including sensing, controlling, monitoring, and responding. […] Fast development of machines and devices, new sensor technologies, and intelligence that is integrated to production equipment and measurement devices have created totally new possibilities for making IoT a novel form of business and a versatile tool box of renewable industry, which provides solutions to many problems related to process monitoring, diagnostics, control, and optimization.

When objects can represent themselves digitally, they can be controlled remotely and more precisely, and it is then possible to fully track their progress from point A to B to C. Effective control of material flows improves inventory control and production scheduling. Today, many manufacturers are required to accurately identify their products both for internal record keeping purposes and due to their customers’ requirements for traceability

Data Matrix

Manufacturers of electronic devices, such as IGBT modules and power transistors, are looking for a reliable, cost effective method for uniquely identifying and tracking products through the manufacturing cycle and distribution. The code must be durable so it can survive the manufacturing process but must not affect circuit performance. It must also be able to store information in the small space available on PCBs and components.

Figure 2. Data Matrix code dimensions can vary to accommodate the complexity of the data encoded.

Figure 2. Data Matrix code dimensions can vary to accommodate the complexity of the data encoded.

A Data Matrix is a 2D code capable of encoding large amounts of text or numeric data in a compact space. Of the available 2D tracking methods, the Data Matrix code has emerged as the accepted standard for electronics and other manufacturing industries.

Data Matrix codes are used as unique IDs for managing individual parts and material lots. The codes add tracking and security information to a master card or every single piece on a master card and then are used to register such details as the lot number, date of production, test program name, and revision number.

These 2D codes are read by vision-based systems rather than the laser scanners used with 1D bar codes. A camera takes a picture of the code, and then the software finds the code in the image, orients it, and extracts the data.

Data Matrix codes encode information digitally, can accommodate low-contrast printing directly on parts, provide high information density, are easily scalable to various levels of magnification, have built-in error correction, and can be read in any orientation.

curamikRogers can add Data Matrix codes to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. Codes, which can be text or numeric in form and encoded by code-reading camera systems, are written on metalized surfaces by means of a thin oxide layer formed by an optical laser system; no additional material is required on the substrate. In addition to bare copper surfaces, data matrix codes can be written on nickel (Ni), nickel/gold (Ni/Au), and silver (Ag) plated surfaces.

For more information:


The EMS Mass Transportation marketing team recently returned home after a busy week of exhibiting our silicone material products at the InnoTrans show in Berlin.


The event, a leading international trade fair for transport technology, was well-attended with approximately 140,000 visitors spending time with over 3,000 exhibitors from 62 countries. Occupying all 41 exhibition halls at the venue, the show was divided into 5 major segments: railway technology, railway infrastructure, public transport, interiors, and tunnel construction. In addition to all the activity inside the show, outside there was a large outdoor area that offered vehicle manufacturers an opportunity to exhibit electric busses on a Demonstration Course and in a nearby static display area.

We had a wonderful time speaking with everyone who came by our booth to find out more about our BISCO, PORON, and ARLON product families.

innotrans_blog2_smPart of the BISCO product family, MF1 Foams are well-suited for use in rail applications due to their durability, fire resistance properties, and low compression set. In addition, our HT-200 silicone material is commonly used as an acoustic barrier in rail cars, while our HT-800 series silicone is often found used in floating floors as it has been proven successful in significantly reducing interior cabin noise. Our ARLON silicones, are well-known in the rail industry as well, widely-recognized as efficient problem solvers for gaskets and seals, coil insulation, and self-fusible tapes. For more information on Rogers’ complete line of silicone materials please visit our web site

We’re looking forward to another great show in 2018!

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