As electronic devices continue to shrink in size and increase in power, demand grows for power electronic circuits with higher power density. Increased operating temperatures are one of the tradeoffs of higher circuit power density, resulting in an increase in thermal stress for the circuit materials that serve as substrates for modern power electronic circuits. New processes and materials are available to address these challenges.

Soldering vs Silver Sintering

Soldering can present a number of complications that reduce a circuit’s performance, such as solder bridges and heel cracking. At higher operating temperatures, solder fatigue becomes an issue. Common die attach technologies are based on soft solders with melting points below 250°C. With the development of new generations of semiconductors (e.g. based on wide band gap materials like SiC and GaN), operating temperatures increase to more than 200°C. This will lead to a significant decrease in the solders‘ strength and reliability.

Sintering is a heat treatment process applied to a powdered material in order to give it higher strength and integrity. Silver sintering has become a promising technology for high temperature power electronics packaging as an alternative to soldering.

In the soldering process, heat is applied until a solid reaches its melting point and is then allowed to cool down and solidify to form a bond. In the silver sintering process, heat is applied to a silver paste, resulting in densification. Several actions occur simultaneously, including grain growth, pore growth, and densification, resulting in a stronger bond.

Find out what you need to know about silver sintering in the tech note: curamik® Substrates for Silver Sintering.

PCB Materials for High Power, High Temp Applications

The requirements for PCB materials capable of supporting high-density power electronics circuits are quite challenging, since they include both mechanical and electrical stability at high temperatures.

To meet these demands, curamik® ADVANTAGE provides a ceramic-materials based solution for smaller, higher power-density PCB circuits in power electronic applications. These ceramic substrates provide low dielectric loss and low-loss copper conductors that support high voltages and currents in power-grid, energy, and industrial power applications.

To improve the performance and usability of the substrate materials, all curamik ADVANTAGE products include a choice of plating materials, addition of solder stop to control solder coverage, and treatment for surface roughness. As an alternative to soldering, a state-of-the-art silver sintering process provides an attachment option to solder for critical high-temperature applications

Download the Power Magazine article for more details: Tailoring Circuit Materials for Power Electronic Applications

Watch the curamik ADVANTAGE video:



Ten company teams, including Rogers Germany, recently came together for the 3rd annual soccer tournament benefitting Heilpädagogisches Zentrum (HPZ), a local organization supporting the mentally handicapped community. HPZ operates several schools in the Pfaffenhofen, Germany area, including the Anna-Kittenbacher School, the Geisenfeld Special Educational Center, the Adolf-Rebl-Schule Development Center for Intellectual Development, an Early Intervention Center, and an array of programs including therapeutic days, social educational days, and open help.

The Rogers Germany team is a regular supporter of HPZ. Also supporting HPZ in the soccer tournament were Siemens Kemnath, Weiden Police, Stadtwerke Weiden, and BHS Corrugated Weiherhammer. The highlight of the tournament was the unified HPZ Team — a mix of players, some who had disabilities and some who did not – who joined in the fight to the victory cup!

The tournament included great soccer games, treats brought by HPZ, and a raffle with lots of great prizes.

While Rogers Germany gave it their all, the final match came down to the Weiden Police vs the unified HPZ Team. Congrats to the Weiden Police, who went on to win. In the end, the HPZ organization was happy and considered the annual charity event a great success! Proceeds from the event went to the HPZ in Irchenrieth, which fosters people with mental and physical disabilities and helps them with integration into society.

Kudos and many thanks to the Rogers Germany team for their passion and dedication to the tournament and to HPZ.

Standing (left to right): Matthias Keck, Benjamin Reiter, Michael Pfleger, André Brunner, and Korcaj Milot. Front (left to right): Markus Walberer, Alexander Schäffler, Daniel Küfner, and Michael Melchner.

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We are delighted to officially open our new Corporate Headquarters here in Chandler, AZ. We are thrilled to call Chandler home and would like to thank all our employees and the Arizona community at large for their support before and during our relocation to Chandler.

This is a time of great opportunity for Rogers

Rogers is a company with a proud tradition of anticipating and adapting to changes in the world around us. And we’ve had a lot of practice! For over 185 years we have always looked to the future: identifying and acting upon the dynamics and trends in markets and technology that can enable us to prosper and grow. The relocation of our Global Headquarters to Chandler embodies our continued orientation towards a bright future.

As The Innovation and Technology Hub of the Southwest, Chandler offers Rogers:

  • A Business-friendly climate and a robust local economy to support our needs.
  • A well-established Infrastructure for future expansion.
  • Easy connections to West Coast technology hubs, which are strategically vital to Roger’s future success.
  • And a strong talent pool across the valley which is a real competitive advantage for us.

We know all this because 2017 represents Rogers 50th year as part of the Chandler business community. Over the years we have had a mutually beneficial relationship with Chandler, Maricopa County, the State of Arizona and our regional business and civic partners all of whom have been extremely supportive as we have grown our presence here. We owe a debt of gratitude to many of you in attendance today for your unwavering assistance and cooperation over many years.

Today we are fulfilling “the promise of Rogers”

We offer advanced products and technology that power, protect and connect our world, from electric automobile drive systems to protective sports equipment to automotive radar sensors to cell phone transceivers and much more. We are at the forefront of the applied materials technology frontier.

Our three businesses, Advanced Connectivity Solutions, Power Electronic Solutions and Elastomeric Materials Solutions are all thriving and growing substantially.


Our move here to Chandler could simply not have been possible without the tireless support and hard work of so many of our Rogers’ colleagues.

And finally, we are thankful for the strong support from the Arizona community and business partners:

  • U.S. Congressman Andy Biggs’ Office, District Director, Greg Safsten,
  • Senator Sean Bowie,
  • Representative Jill Norgaard,
  • Mayor Jay Tibshraeny,
  • Vice Mayor Kevin Hartke,
  • Tyler Gentry, VP Business Attraction, Arizona Commerce Authority,
  • Chris Camacho, President/CEO, Greater Phoenix Economic Council (GPEC),
  • Marsha Reed, City Manager, City of Chandler,
  • Nachie Marquez, Assistant City Manager, City of Chandler,
  • Joshua Wright, Assistant City Manager, City of Chandler,
  • Micah Miranda, Economic Development Director, City of Chandler,
  • James Smith, Economic Development Program Manager, City of Chandler,
  • Terri Kimble, President/CEO, Chandler Chamber of Commerce, and
  • Ganesh Moorthy, President and COO of Microchip, and Rogers Board of Directors.

Thank you, everyone!

We are thrilled to call Chandler home as we continue to fulfill the promise of Rogers.



The Rogers team is passionate about helping the world’s leading innovators solve their toughest material challenges to help power, protect, and connect our world. How we conduct our business is just as important as what we achieve. We strive for “Results, but Results in the Right Way.” That means making choices that are based on what is ethically sound and not just what is easy or expedient.

We believe that corporate responsibility is a commitment to managing our activities in a responsible way from business ethics to health and safety to human rights. This is why we have spent a great deal of time developing the Rogers Corp. Corporate Responsibility hub and updating our Code of Business Ethics.

“Our corporate reputation is built on the trust and confidence of our employees, customers, stakeholders, and the communities in which we operate,” states Bruce Hoechner, CEO. “This trust is one of our most valuable assets. Our Code of Business Ethics explains what is expected of each of us at Rogers as we work to achieve our business goals. Compliance with this Code is mandatory and the cornerstone of our ethical culture that we reaffirm daily in our business activities.”

The Rogers Code of Business Ethics describes how our cultural behaviors are to be translated into concrete actions. It is organized around the following policies:

The Rogers Corporate Responsibility hub provides an inside look at the conscience of our company and how we operate around the world. Updating our Code of Business Ethics is the next step in an evolving commitment to demonstrate what we believe in at Rogers Corp. Stay tuned for more.

If you have questions, please contact the Rogers Legal and Compliance Department or Ben Buckley, Associate General Counsel & Director of Global Compliance and Integrity, at

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This post authored by John Coonrod, Technical Marketing Manager, and team originally appeared on the ROG Blog hosted by Microwave Journal.

Growing demand for mobile wireless communications services has quickly eclipsed the capabilities of Fourth Generation (4G) Long Term Evolution (LTE) wireless networks and created a need for a next-generation mobile wireless network solution. Fifth Generation (5G) wireless networks promise more capacity and capability than 4G LTE systems, using wider channel bandwidths, new antenna and modulation technologies, and higher carrier frequencies even through millimeter-wave frequencies. But before 5G wireless networks can become a reality, systems and circuits will be needed for higher frequencies than current 2.6-GHz 4G LTE wireless networks.

Standards are still being formulated for 5G wireless networks, with goals of achieving data rates of 10 Gb/s and beyond with low latency, using higher frequencies than in traditional wireless communications systems. In the United States, for example, last year the Federal Communications Commission (FCC) approved the use of frequency bands at 28, 37, and 39 GHz for 5G.

PCB Materials for Millimeter Waves

For circuit designers, one challenge will be in knowing where to start, which means, for millimeter-wave frequencies, knowing what types of printed-circuit-board (PCB) material characteristics are the most important at higher frequencies. Millimeter-wave frequencies (above 30 GHz) were once used almost exclusively by the military and for research experiments, but 5G represents an opportunity to “popularize” millimeter-wave frequencies and make them part of everyday life, not just for exotic electronic devices in the limited quantities used in research and by the military, but for potentially billions of electronic devices for people and things, as in how Internet of Things (IoT) devices will use 5G networks for Internet access.

Designing circuits at millimeter-wave frequencies starts with the right PCB material, and knowing how different PCB characteristics affect circuit performance at millimeter-wave frequencies. Variations in certain circuit material parameters, such as dielectric constant (Dk), can have greater impact on performance as the operating frequency increases. For example, signal power is a valuable commodity at millimeter-wave frequencies, requiring circuit designers to minimize loss in their circuits as much as possible. This begins with the choice of PCB material, since a PCB material not meant for use at millimeter-wave frequencies can result in excessive signal losses when operated beyond its intended operating frequency range.

PCB materials can degrade signal power in three ways: radiation losses, dielectric losses, and conductor losses. Losses through radiation of EM energy largely depend on the circuit architecture, so even the lowest-loss PCB material may not save a circuit configuration that has a tendency to radiate energy.

A thoughtful choice of PCB material can help minimize dielectric and conductor losses at millimeter-wave frequencies. A circuit material’s dielectric loss is closely related to its dissipation factor (Df) or loss tangent, which increases with frequency. The Df is also related to a material’s dielectric constant (Dk), with materials that have higher values of Dk often have higher Df loss, although there are exceptions. Attempts to minimize dielectric losses for millimeter-wave circuits can be aided by considering circuit materials with low Df values.

Controlling Conductor Loss

Finding a material with low conductor losses at millimeter-wave frequencies is not as straightforward, since conductor losses are determined by a number of variables, including the surface roughness and the type of finish. As the name suggests, millimeter-wave signals have extremely small wavelengths, mechanical variations in a circuit-board material can have significant effects on small-wavelength signals. Increased copper surface roughness will increase the loss of a conductor, such as a microstrip transmission line, and slow the phase velocity of signals propagating through it. In microstrip, signals propagate along the conductor, through the dielectric material, and through the air around the circuit material, so the roughness of the conductor at the interface with the dielectric material will contribute to the conductor loss. The amount of loss depends on frequency: the loss is greatest when the skin depth of the propagating signal is less than the copper surface roughness. Such a condition also degrades the phase response of the propagating signal.

The impact of copper surface roughness on conductor loss depends on the thickness of the PCB material: thinner circuits are more affected than thicker circuits. The effects of copper surface roughness on loss become apparent at millimeter-wave frequencies. For example, two circuits based on 5-mil-thick RT/duroid® 6002 circuit material from Rogers Corp. but with two different types of copper conductor and surface roughnesses were tested at 77 GHz. The circuit with rolled copper and root mean square (RMS) conductor surface roughness of 0.3 μm exhibited considerably lower conductor loss than the same circuit material with electrodeposited (ED) copper conductor having 1.8-μm surface roughness.

Propagation of the small wavelengths at millimeter-wave frequencies can also be affected by the type of finish used on a PCB’s conductors. Most plated finishes have lower conductivity than copper, and their addition to a copper conductor will increase the loss of the conductor, with loss increasing as the frequency increases. Electroless nickel immersion gold (ENIG) is a popular finish for copper conductors; unfortunately, nickel has about one-third the conductivity of copper. As a result, ENIG plating will increase the loss of a copper conductor, with the amount of loss increasing as a function of increasing frequency.

Environmental Effects

Environmental conditions can also impact the amount of loss exhibited by a PCB material, especially at millimeter-wave frequencies. Many network scenarios for 5G predict the need for many smaller wireless base stations than used in earlier wireless network generations, in part because of an increased number of expected users and the use of millimeter-wave frequencies and their shorter propagation distances than lower-frequency carriers. Where 5G base stations cannot be maintained in climate-controlled environments, circuits may be subject to changing environmental conditions, such as high relative humidity (RH). Water absorption can dramatically increase the loss of a PCB material, and the loss of circuit materials with high moisture absorption will be greatly affected under high RH conditions.

Testing on 5-mil-thick RO3003™ circuit material from Rogers Corp. for two different operating environments showed how loss at millimeter-wave frequencies can increase with RH. One circuit was maintained at room temperature and the other was subjected to +85ºC and 85% RH for 72 hours. At 79 GHz, the room temperature material had about 0.1 dB/in. less loss than the material subjected to higher humidity and temperature. When testing was performed on a third, thermoset circuit material from a different supplier, the increase in circuit loss at 79 GHz was even more dramatic.

For those interested in learning more about the nuances of selecting PCB materials and designing circuits for 5G, in particular at millimeter-wave frequencies, Rogers has created a number of tutorial videos in the “The Road to 5G” series. The videos guide viewers on what different circuit material parameters mean at millimeter-wave frequencies, and which material characteristics make the most difference at those higher frequencies. The videos offer quick and easy ways to learn how to specify PCB materials for 5G, and to get ready for this next revolution in wireless communications.

ROG Mobile App

Download the ROG Mobile app to access Rogers’ calculators, including the popular Microwave Impedance simulation tool, literature, technical papers, and the ability to order samples of the company’s high performance printed circuit board materials.

Ask an Engineer

Do you have a design or fabrication question? Rogers Corporation’s experts are available to help. Log in to the Rogers Technology Support Hub and “Ask an Engineer today.

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