Join us at APEX EXPO 2015, February 24-26, 2015, at the San Diego Convention Center, San Diego, CA. Rogers Corp. (booth 1701) and Arlon (booth 2306) will be demonstrating their newest circuit materials and engineered silicones.

In addition, our own John Coonrod will be presenting during the conference:

•  Wednesday, Feb 25, 10:30am – 12:00pm: The Effects of PCB Fabrication on High Frequency Electrical Performance. Room 3.

•  Thursday, Feb 26, 9:00 – 11:00am: Thermal Management Advantages of Thermally and Electrically Conductive Adhesive. Room 2.



We will announce earnings results for our 2014 Q4 and year-end after the close of trading on Tuesday, February 17, 2015. A copy of the release will be available on the Rogers website at

RogersCorporation logoAll interested parties are invited to participate in Rogers’ quarterly teleconference to be held on Wednesday, February 18, 2015 at 9:00 am ET. Bruce D. Hoechner, President and CEO, and members of senior management will review the results and then respond to questions.

To participate in the teleconference please call 1-800-574-8929 toll free in the U.S. or 1-973-935-8524 from outside the U.S. There is no pass code for the teleconference.

For interested parties who do not wish to ask questions, the call is being webcast live by Thomson Reuters and may be accessed through a link on the Rogers website at

A slide presentation will be made available prior to the start of the call. The slide presentation may be accessed on the Rogers Corporation website under the Investor Relations section of the following web page

As the demand for thinner, larger, and more expensive LCD displays continues to grow, designers and manufacturers face new challenges with these increasingly complex technologies…which, unfortunately, usually end up being dropped.

Can a gasket save your smartphone’s LCD glass from breaking? In this video we stack up PORON®’s Shock Seal™ against the competition…to see who will prevail.

PORON ShockSeal foams are specifically engineered to meet the challenging cushioning, sealing, and protection requirements that larger displays demand. Handheld Grade ShockSeal foam is available as thin as 0.5 mm, and conveniently conforms to some of the smallest and most intricate manufacturing designs.


Now you can download the microwave circuits presentations discussed during John Coonrod’s Microwave Journal webinars. Log into our Advanced Circuit Materials Tech Support Hub.

October: High Frequency Materials and Characterization up to Millimeter Wave Frequencies

November: Essential Thermal Mechanical Concepts Needed in Today’s Microwave Circuit Designs

Our thanks to Microwave Journal for hosting.



Visit Rogers Corporation’s Advanced Circuit Materials at DesignCon, January 28-29, 2015. We’re in booth 749 at the Santa Clara Convention Center.

We’ll be featuring our new ULTRALAM® 3850HT laminates. This is a higher temperature LCP material for more robust high temperature, multi-layer PCB designs. The higher melt temperature also provides improved dimensional stability.

Don’t miss our own John Coonrod on the DesignCon panel, “Isn’t GBPS Design Complex Enough? Now High Speed Circuit Boards Act Like Microwave Components!” January 27th, 4:45 – 6:00pm.