Part of being a conscious global citizen is realizing that it’s possible to make a difference. Rogers is well aware of the impact a company can have.

This year, Rogers Hungary chose to support an organization that serves a noble purpose and contributes to making the world a better place. Út a Mosolyért Alapítvány (The Smile Foundation) in Dunakeszi, Hungary, facilitates the curing of sick children. Our donation contributes to the foundation’s purchase of an intensive care bed, which will increase the survival rate of children taken to hospital.

József Sinkó Plant Manager represented Rogers Corp. at the donation ceremony. He said, “We are proud that through our business activities we can save the lives of children.”

About Út a Mosolyért Alapítvány

The foundation is focused on the education, employment, and health rehabilitation of disabled children and young adults in Hungary. The foundation provides programs that support equal opportunity and and help the disabled develop their skills and abilities so they can earn own livelihoods and improve their living conditions.

 

Selected quotes from our recent earnings call. Read the corporate financials news release: Rogers Corporation Reports First Quarter 2017 Results

In Q1 2017, Rogers achieved all time record quarterly net sales and earnings. Our sales were $204 million, an increase of 27% over Q1 2016. Results were driven by organic sales with solid growth in each of our business units, as well as exceptional performance in our recently acquired businesses. This is confirmation that we have implemented a winning strategy and our solid execution is taking Rogers to a new level of performance.

Bruce Hoechner, CEO, on Innovation Leadership

We are confident that our technology portfolio, marketing initiatives, and new product pipeline are well aligned with the growth drivers of Advanced Connectivity and Advanced Mobility where our solutions are proven, innovation is valued, and the growth outlook is compelling.

Bruce Hoechner, CEO, on Growth Drivers

As a market-driven organization, we are focused on select markets that are far outpacing global GDP growth, for example, Advanced Driver Assistance Systems (ADAS) and the Internet of Things. We are well positioned to take full advantage of these significant opportunities as the markets grow.

Rogers’ innovation expertise is enabling us to develop a new product platform to meet the most challenging segment of the Wired Internet infrastructure market. Our extremely low loss material is in various stages of customer qualification at key network infrastructure OEMs. Customer testing and feedback indicate that our material enables a performance level previously thought unachievable on copper clad laminate systems.

Our operational excellence initiatives are helping us improve profitability in four key areas: footprint rationalization, process improvement, optimizing cost structure, and back office utilization. We have refined our growth strategy by business unit to enable ACS, EMS, and PES to capitalize on their individual market opportunities and capabilities to accelerate growth.

Bruce Hoechner, CEO, on Rogers’ Business Units

Advanced Connectivity Solutions (ACS) achieved all time record revenue growth in Q1 2017, driven by continued strong demand in ADAS, as well as in aerospace and defense. Rogers has achieved several substantial 4.5G design wins as telecom equipment OEMs and telecom service providers move to the next level of system performance. We are very encouraged by the acceleration in the development of the 5G technologies. Other promising opportunities include automotive OEMs that are offering more models with ADAS features and fast tracking their plans to introduce cars with autonomous capabilities, both of which utilize Rogers Technologies. Overall, we continue to broaden the ACS portfolio of wireless infrastructure, wired infrastructure, advanced mobility, and aerospace and defense solutions to meet unsolved needs in the market.

In Elastomeric Material Solutions (EMS), demand across all of our product lines contributed to organic growth in the portable electronics, general industrial, automotive, and mass transit segments. Significant contributions from our acquired DeWAL and DSP businesses helped EMS achieve all time record quarterly net sales. As we look ahead, we expect to see continued penetration in the back pad solution for portable electronics, as well as in high performance gasketing for automotive applications.

Power Electronics Solutions (PES) net sales during the quarter increased due to broad based demand in many key markets, including renewable energy, hybrid electric vehicles, variable frequency motor drives, rail, and laser diode cooling products. Government mandates and consumer demand continue to drive adoption of eMobility applications, particularly in electric and hybrid electric vehicles. We expect to see continued growth, particularly in clean energy applications such as variable frequency drives, renewable energy, and advanced mobility.

Q1 2017 Earnings Call Full Transcript 

Q1 2017 Financials Press Release

Q1 2017 Earnings Call Slides

 

This post authored by John Coonrod, Technical Marketing Manager, and team originally appeared on the ROG Blog hosted by Microwave Journal.

Circuit materials are evaluated by a number of different parameters, including dielectric constant (Dk) and dissipation factor (Df). Those two parameters also have temperature-based variants that provide insight into the expected behavior of a circuit material with changes in temperature, notably the thermal coefficient of dielectric constant (TCDk) and the thermal coefficient of dissipation factor (TCDf). The parameters detail the amounts of change in a material’s Dk and Df, respectively, as a function of temperature, with less change representing a material that is more stable with temperature.

A circuit material with an ideal TCDk, with a Dk that would remain at a fixed value even as the temperature changes, would have a TCDk of 0 ppm/°C. In the real world, however, circuit materials exhibit some change in Dk with changing temperature. A circuit material considered to have stable Dk with temperature will have a very low value of TCDk, typically less than 50 ppm/°C. When an application requires that a circuit board be subjected to a wide operating-temperature range and deliver stable performance all the while, a circuit board’s TCDk parameter is one of the key specifications to consider after determining the required Dk for that application’s circuits.

Although circuit temperature stability requirements for military and aerospace applications are well documented, due to the typically hostile operating conditions of military circuits and systems in the field, commercial applications can also endure conditions of changing temperatures that can require better-than-average circuit-board TCDk performance. Power amplifiers for wireless base stations or outdoor-mounted microcells may not experience the wide temperature swings of military environments, but they depend on circuit Dk stability with temperature to maintain stable gain and output power. Their active devices are impedance matched to a typical 50-Ω circuit/system environment for optimum gain, output power, and power-added efficiency, and changes in Dk will cause variations in amplifier performance. In addition to environmental temperatures, the self-heating effects of amplifiers can further complicate changes in a material’s Dk characteristics with temperature, especially for materials with high values of TCDk.

Similarly, passive components, such as filters, can suffer from unwanted frequency changes with changes in Dk, such as shifts in passbands and stopbands. Ideally, wireless base stations would be maintained in temperature-controlled environments but, again in the real world, this is often not the case, and circuit-board TCDk is then a key performance parameter of interest.

When performance with temperature is important, specifying a circuit-board material should be done deliberately and by taking a close look at available data sheets. Circuit designers should never assume that two materials from the same manufacturer or the same product line will have the same TCDk characteristics. Different materials based on PTFE, for example, can have widely different values of TCDk. PTFE, of course, is the basis for many excellent, low-loss, high-frequency circuit materials, but the TCDk characteristics of these materials can vary widely. Some PTFE-based circuit materials can suffer large changes in Dk with temperature, evidenced by TCDk values of 200 ppm/°C and even higher.

At the same time, some PTFE-based circuit based materials can provide near-ideal TCDk characteristics. PTFE-based RO3003™ circuit material from Rogers Corp. has outstanding TCDk of -3 ppm/°C, making it a strong candidate for temperature-sensitive circuit designs facing wide operating temperature ranges. The family of circuit laminates includes materials with Dk from 3.00 to just over 10.00 when measured through the z-axis (thickness) of the material at 10 GHz. The laminates are popular circuit choices for military and commercial applications through millimeter-wave frequencies of 77 GHz and higher, including in automotive radar systems which much maintain stable performance over wide temperature extremes.

Just as suppliers of circuit materials may test and specify the Dk values of their materials in different ways, such as at different test frequencies, any valid comparison of circuit materials for their TCDk performance levels calls for an understanding of the measurement methods used to determine TCDk for a particular material. Material measurements are often based on industry-standard IPC test methods for agreement of values among different material suppliers.

For example, measurements of circuit laminate TCDk at Rogers Corp. are performed by means of the clamped stripline test detailed in IPC test method IPC-TM-650 2.5.5.5c. Prior to testing a circuit laminate, all of the copper is etched from the substrate. The substrate is then clamped into a fixture, which behaves like a loosely coupled stripline resonator. The fixture and its material to be tested are placed into a laboratory temperature-controlled environment, such as an oven. The temperature is changed in steps and the fixture and material are allowed to reach thermal equilibrium with each change in temperature before the Dk is measured. Many measurements are performed to cover a wide operating temperature range and to measure the Dk at different points across that temperature range. The end result is a curve of Dk versus temperature for that material, which is the TCDk of that material.

Temperature-Dependent Loss

Just as TCDk is a barometer of how a material’s Dk changes with temperature, TCDf is a measure of a circuit material’s dissipation factor (Df) or loss tangent and how it changes with changing temperature, typically with loss increasing as temperature increases. As with TCDk, the temperature effects of TCDf can impact the performance of both active and passive circuits. At higher temperatures, a circuit material with high value of TCDf can compromise the gain and output power of an amplifier, and increase losses in passive circuits, such as filters or passive antennas.

The TCDf values of circuit materials from Rogers Corp. are characterized with a measurement method that is the same as that used for testing TCDk. The measurements are complicated by the variations in the loss properties of the resonator circuit, which is integral to the clamped stripline fixture and the fact that copper conductivity changes with temperature. Rather than attempting to measure and report Df versus temperature to derive a TCDf value for the material, loss versus temperature is measured, where it is the loss of the resonator in the form of its inverse quality factor (1/Q). As with TCDk, an ideal value of TCDf would be close to zero, to indicate little or no change in dissipation factor with temperature. In the real world, circuit materials with the lowest possible values of TCDf are to be preferred for temperature-sensitive circuit applications, whether for active or passive circuits.

All of the information shown above is in regards to the effect of temperature on the Dk and Df properties (TCDk and TCDf) of material when considering a short-term thermal event.  How a laminate responds to long-term thermal exposure is a different subject than TCDk and TCDf, even though these properties can be involved with long-term thermal aging evaluations.  These aging evaluations are critical to understand if the circuit material is the proper choice for the conditions it will be exposed to in the end-use environment and that it will meet the needs of the intended application over the life of the product.  More information on long-term thermal aging can be found a in two-part series blog, Picking A PCB For High Reliability and PCB Formulated for Reliability.

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Download the ROG Mobile app to access Rogers’ calculators, including the popular Microwave Impedance simulation tool, literature, technical papers, and the ability to order samples of the company’s high performance printed circuit board materials.

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A DC link is a connection between a rectifier and an inverter found in converter and VFD circuits. The DC capacitor helps prevent transients from the load side from going back to the distributor side. It also serves to smooth pulses in the rectified DC.

This webinar by the our Power Electronics Solutions group reviews the design of a DC Link System using optimized solutions based on integrated capacitor-busbar technology from Rogers Corporation.

Due to lower overshoot voltages and less uF/kW of required total capacitance, this solution offers lower total system cost and increased power density. The integrated capacitor-busbar assemblies are developed for critical DC link applications in traction drive inverters for HEV/EV, and inverter systems for solar and wind power.

View the webinar now.

Integrated Capacitor-Busbar Technology

The ROLINX® CapEasy and ROLINX® CapPerformance capacitor-busbar assemblies combine extremely low inductance and high power density to create small, lightweight devices. They feature a unique Power Ring Film Capacitor™ technology from SBE Inc. and the well-known ROLINX Laminated Busbars from Rogers Corporation. The result is reduced total system cost, improved reliability, and increased power density compared to currently available solutions.

ROLINX® CapEasy and ROLINX® CapPerformance advantages:

  • Ability to handle higher ripple currents
  • Lowest industry ESL with an integrated busbar structure
  • Increase system reliability and lifetime
  • Low system weight and volume

Download the data sheet.

View the product overview video.

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Today’s manufacturers of automotive fleets and mass transportation systems are motivated to meet fuel efficiency and emission requirements, as well as market demands for reduced costs. e-Mobility (electro mobility or advanced mobility) refers to clean and efficient electric and hybrid vehicles that use electric powertrain technologies, in-vehicle information, communication technologies, and connected infrastructures.

e-Mobility efforts are gaining traction around the world. According to EURACTIV, Europe is making major gains:

Metros and tramways are electric and provide high-capacity, zero-emission public transport systems in many European cities. Likewise, about 80% of Europe’s mainline rail traffic is powered by electricity. Several EU member states are now pushing towards a 100% electrified rail network, with the potential to reduce the CO2 emissions of rail to zero if they achieve it.

And road transport is catching up. Last year, the number of electric vehicles (EVs) purring up and down the world’s roads surpassed two million. This may not seem a lot when set against the total number of cars on the road (which is probably in excess of a billion) but it does represent remarkable and sustained growth. EV sales climbed by nearly 40% in the US last year, while China has become the largest single market in the world for EVs and plug-in hybrids, with sales only expected to grow as government-backed investment presses on.

You can find Rogers’ advanced materials in a wide variety of eMobility platforms: power electronics solutions for electrical oil pumps and battery packs, high-frequency PCB laminates for electrical power steering and antennas, and gaskets and vibration management foams for airbag sensors and sound systems. Let’s take a closer look at the electronics inside these vehicles.

 

High frequency PCB substrates are found in Adaptive Cruise Control, Antenna Boosters, Automated Tolling Tags, Blind Spot Detection, Collision Avoidance and Mitigation, GPS, Rear Cross Traffic Alert, Telematics, and V2X Antennas.

Ceramic substrates are found in Air Conditioning Compressors, Battery (Fast) Chargers, Converters, Electrical Power Steering, Inverters, Liquid Heater PTC, Oil Pumps, Start-Stop Systems, and Vacuum Pumps.

Power distribution systems are found in AC-DC Converters/DC-DC Converters, Battery Modules, Motors, Power Steering, and Start-Stop Systems.

Active Safety Systems

New cars are increasingly equipped with robust crash avoidance technologies. These active safety technologies are enabled by innovative Advanced Driver Assistance Systems using sensor technologies, such as radar, to detect collisions.

Rogers’ Advanced Connectivity Solutions group provides high performance PCB laminates for 24 GHz and 77 GHz automotive radar sensor applications. The RO4000® and RO3000® series materials enable radar sensors to detect upcoming collisions to prevent road accidents. In addition, RO4000® high frequency circuit materials are successfully used in 24 GHz radar sensors for blind spot detection or rear cross traffic alert.

Forward collision warning, emergency brake assist, adaptive cruise control, and traffic jam pilots require radar sensors that operate in the 76-81 GHz range. RO3000® High Frequency Laminates have an excellent Dk tolerance of ± 0.04 and at this high frequency concerns with insertion loss are paramount. These laminates also offer an extremely low dissipation factor, ensuring the dielectric loss component of insertion loss will be very low.

Vehicle to vehicle (V2V) or vehicle to infrastructure (V2I) communications systems send information via dedicated short range at 5.9GHz (DSRC) or intelligent transportation system G5 (ITS-G5) and 3G/4G cellular network. Rogers’ high frequency materials help antenna´s and modules to achieve high performance and reliable connections between cars and infrastructure even at high speed and under harsh vehicle environments.

Power Connectivity and Distribution

As power from a battery is expensive, the challenge is to use the electric power as efficiently as possible. The primary inverter needs to minimize switching losses and maximize thermal efficiency. Auxiliary inverters are used to power vehicle electrification solutions. The range of the vehicle is directly related to the efficiency of these inverters.

Semiconductor-based power systems are able to optimize overall system cost, minimize power losses, increase power density, maximize power savings, extend mileage, and improve battery efficiency.

RO-LINX® busbars from the Power Electronics Solutions group focus on efficient power distribution and lower energy losses, increasing the range of electric vehicles. These laminated busbars provide a customized liaison between the power source and capacitors, resistors, integrated circuits (ICs), integrated gate bipolar transistors (IGBTs), or complete modules. 

Within the circuit board, power substrates provide interconnections and cool components. curamik® ceramic substrates are designed to carry higher currents, provide higher voltage isolation, and operate over a wide temperature range.

 

 

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