Our Advanced Circuit Materials group is pleased to announce the availability of ULTRALAM® 3850/3850HT PCB laminates. These adhesiveless circuit materials use temperature resistant liquid crystalline polymer (LCP) as the dielectric film. They are designed for single layer and multilayer substrate constructions, and are well suited for high speed and high frequency applications, including:

  • Telecommunication network equipment, such as high speed routers
  • High-speed computer data links

The ULTRALAM 3850/3850HT laminates feature a high temperature LCP material to facilitate more robust, high temperature, multi-layer designs. The higher melt temperature provides improved dimensional stability.

Find out more about the ULTRALAM® 3850/3850HT PCB laminates. Samples available.



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